美國Ablestik 銀膠84-1L
1.84-1LMISR4DESCRIPTION
Ablebond® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of Ablebond
84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes Ablebond 84-1LMISR4 adhesive one of the most widely used die attach materials in the semiconductor industry.
2.84-1LMISR4FEATURES
• Excellent dispensability with minimal tailing and stringing
• Box oven cure
1.84-1LMISR4銀膠概述
Ablebond® 84-1LMISR4 導(dǎo)電粘晶膠 非常適用在高產(chǎn)率、自動(dòng)粘晶設(shè)備 上。Ablebond® 84-1LMISR4 導(dǎo)電粘 晶膠的流變特性使得它可以進(jìn)行最 小劑量的點(diǎn)膠，以及最小的粘晶停 留時(shí)間，并且沒有拖尾或拉絲問 題。因此，Ablebond® 84-1LMISR4 獨(dú)特的粘接性能使得它成為半導(dǎo)體 工業(yè)中最為常用的粘晶材料之一。
2.84-1LMISR4銀膠特性
• 優(yōu)良的點(diǎn)膠性能，具有最小的拖 尾或拉絲現(xiàn)象
• 箱式烘箱中固化 |
